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Japan Pure Chemical Co., Ltd. (4973.T)

Japan Exchange Group Basic Materials Chemicals - SpecialtyView data quality →
53.3Fair

ValueMarkers Composite Index

Top 47%#23,497 of 44,707
Slightly Undervalued

5% below intrinsic value ($34)

UndervaluedFair ValueOvervalued
Piotroski
6/9
Neutral
Beneish
-3.39
Low Risk
Altman
9.32
Safe
DCF Value
$34
Undervalued
ROIC
2.0%
Low
P/E
17.0
Fair
Updated: ·Source: Data sourced from SEC filings and institutional providers. Not financial advice.·Report data issue

Japan Pure Chemical Co., Ltd. (4973.T) — VMCI valuation read

The headline on Japan Pure Chemical Co., Ltd. (4973.T) is a 53/100 VMCI score, set against a Basic Materials sector median of 50. That 3-point above-median read reflects the five-pillar weighting and, for a mid-cap name, suggests a relative-value tailwind is in the data.

4973.T insider activity report: 0 buys, 0 sells filed via Form 4 over the past 30 days. The next datable items are the 10-Q schedule and any 8-K-triggering events; both feed the VMCI Integrity pillar more than the price tape.

**Investor frame.** 4973.T trades at 15.0x earnings, 17% below the Basic Materials median of 18.0x sets the value side. ROIC of 15.0% sits 5.0pp above the Basic Materials median (10.0%) sets the quality side. Net debt to EBITDA of -0.8x leaves covenant headroom sets the risk side, the three lines a value buyer reads first on 4973.T.

4973.T fell 0.3% over the trailing 7 days, with a -22.8% read on a 30-day basis.

Japan Pure Chemical Co., Ltd. develops, manufactures, and sells metal plating chemicals for electronic devices in Japan. The company provides gold electroplating formulation for semiconductor applications; gold electroplating formulation for PWB, connector, contact, and soldering uses; strike gold plating formulation that enhances the adherence of plated coatings; flash gold plating formulation for leadframe uses; and palladium electroplating formulation for connector, leadframe, and decorative uses. It also offers gold coating for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and silver-plating formulations. In addition, the company provides non-cyanide immersion silver plating formulations on Cu surfaces; anti-microbial agents for plating tanks and drag-out tanks; impurity removal resin that removes Cu ions dissolved in Au and Pd bath solutions; and carbon filter that is applied to JPC plating chemicals. Additionally, it offers other surface treatment chemicals and stripping agents. Japan Pure Chemical Co., Ltd. was founded in 1971 and is based in Tokyo, Japan.

CEO: Tomoyuki Kojima49 employeesJPwww.netjpc.com

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